TECMA ARIES at interpack 2026 — A successful edition

Tecma Aries sales team and international agents welcoming visitors and meeting customers at the Interpack 2026 exhibition, discussing end-of-line packaging and automation solutions at the Tecma Aries stand.

TECMA ARIES has successfully concluded its participation in interpack 2026, the world’s leading trade fair for processing and packaging, held in Düsseldorf from May 7 to 13, 2026. The exhibition was a valuable opportunity to engage with our clients, partners, and suppliers, discuss end‑of‑line challenges, and explore tailored automation solutions. Beyond the technologies presented, these […]

DJAZAGRO 2026 – Industry meetings in Algiers

Tecma Aries team meeting visitors, customers, and industry professionals at DJAZAGRO 2026 in Algiers, presenting end-of-line packaging and automation solutions while strengthening relationships with existing and prospective customers.

Event Tecma Aries attended DJAZAGRO 2026 in Algiers, a leading trade show for the food processing and packaging industry in North Africa. These exchanges highlighted the demand for reliable equipment adapted to local constraints and supported by long-term technical expertise.

CheeseExpo 2026 – Tecma Aries in the USA

Tecma Aries team meeting dairy industry professionals, customers, and partners at CheeseExpo 2026 in the United States, presenting end-of-line packaging and automation solutions for cheese and dairy production.

Event Tecma Aries took part in CheeseExpo 2026 in the United States, a key event for the international cheese industry. Discussions highlighted the importance of solutions tailored to the specific requirements of the cheese sector, supported throughout the equipment lifecycle.