TECMA ARIES at interpack 2026 — A successful edition
TECMA ARIES has successfully concluded its participation in interpack 2026, the world’s leading trade fair for processing and packaging, held in Düsseldorf from May 7 to 13, 2026. The exhibition was a valuable opportunity to engage with our clients, partners, and suppliers, discuss end‑of‑line challenges, and explore tailored automation solutions. Beyond the technologies presented, these […]
DJAZAGRO 2026 – Industry meetings in Algiers
Event Tecma Aries attended DJAZAGRO 2026 in Algiers, a leading trade show for the food processing and packaging industry in North Africa. These exchanges highlighted the demand for reliable equipment adapted to local constraints and supported by long-term technical expertise.
CheeseExpo 2026 – Tecma Aries in the USA
Event Tecma Aries took part in CheeseExpo 2026 in the United States, a key event for the international cheese industry. Discussions highlighted the importance of solutions tailored to the specific requirements of the cheese sector, supported throughout the equipment lifecycle.