Tecma Aries is pleased to announce its participation in PACK EXPO International 2026, taking place from October 18-21, 2026, in Chicago, Illinois, USA.
As one of the most influential events in the packaging and processing industry, PACK EXPO International brings together manufacturers, automation specialists, packaging professionals, and technology leaders from around the world. This year, Tecma Aries will be showcasing its latest automation and industrial solutions at Booth N-5749.
Meet the Tecma Aries Team in Chicago
Our booth will be staffed by a dedicated team of experts, including:
- Company Directors
- Business Development Managers
- Area Sales Managers
- Packaging & Automation Specialists
- Strategic Partners
- Dedicated U.S. Team Members
This gives visitors a unique opportunity to discuss projects directly with key decision-makers and industry experts who understand the challenges facing modern manufacturers.
Discover Innovative Automation Solutions
At Booth N-5749, visitors can explore how Tecma Aries helps manufacturers improve productivity, efficiency, and operational performance through:
- Industrial Automation Solutions
- End-of-Line Packaging Systems
- Robotic Integration
- Smart Manufacturing Technologies
- Custom Engineered Solutions
- Production Line Optimization
See the Machines and Technologies We Bring to Industry Leaders
Whether you are planning a new investment, expanding operations, or upgrading existing equipment, our team will be available to discuss solutions tailored to your specific requirements.
Visit Us at PACK EXPO 2026
📅 October 18-21, 2026
📍 Chicago, Illinois, USA
🏢 Booth N-5749
🎟 Free Registration Code: 89C22
We invite customers, partners, agents, distributors, and industry professionals to visit us and discover how Tecma Aries can support their future automation and packaging projects.
Schedule a meeting with our team and make the most of your PACK EXPO experience. We look forward to welcoming you at Booth N-5749.