TECMA ARIES will participate in CheeseExpo 2026, a key international event dedicated to the dairy and cheese industry.
Throughout the exhibition, our teams will be available to discuss end‑of‑line packaging solutions, robotic systems, complete packaging lines, and after‑sales services, including equipment upgrades, revamping, and long‑term technical support.
CheeseExpo will provide an opportunity to exchange with industry professionals on production challenges, efficiency, and packaging requirements specific to cheese and dairy products.
Milwaukee, Wisconsin, USA
April 14–16, 2026
Baird Center — North Building
Booth 2145